Indium 8.9 Lead-Free SAC305 Solder Paste
Indium 8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, and other alloy systems favored by the electronics industry to replace conventional Pb- bearing solders. Indium 8.9 offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium 8.9 minimizes false failures in ICT.
Read moreIndium Sn63/Pb37 Halogen Free Wire Solder
Indium Ultra-Clear series of solder wire combines the latest in tin/lead and Pb-free flux technology, satisfying the most recent requirements for no-clean RoHS and REACH compliant materials. Indium CW-802 Halogen-Free No-Clean Wire Solder is the most mildly activated of the series and meets all industry-wide current halogen-free and halide-free requirements. Made with ultra-clear modified rosins, this solder wire offers exceptional heat stability and is compatible with tin/lead, Pb-Free, and high lead-containing alloys.
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